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Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

          Download:  Download xls  Excel 

Use~for the exact search match (i.e. ~NTS2101PT1).

1  Non-hybrid  devices found

Non-hybrid devices

Base part Part Состояние HF Excel IPC175X XML  Mold Compound   Leadframe   Die Attach   Plating   Die   TOTAL 
Brominated epoxy resin
[%]
Antimony compounds (Sb) (Antimony trioxide/pentoxide)
[%]
Fused silica
[%]
Epoxy + Phenol Resin
[%]
Organic Phosphorus compound
[%]
Weight
[mg]
Cu
[%]
Weight
[mg]
Pb
[%]
Sn
[%]
Weight
[mg]
Sn
[%]
Bi
[%]
Weight
[mg]
Si
[%]
Weight
[mg]
Weight
[mg]
n/a 1309-64-4 60676-86-0 n/a n/a n/a 7440-50-8 n/a 7439-92-1 7440-31-5 n/a 7440-31-5 7440-69-9 n/a 7440-21-3 n/a n/a
DBF60G DBF60G Active    Download xls Download xml  3.03   3.03   70.00   13.94   10.00   3633.90   100.00   2599.54   95.01   4.99   35.89   97.49   2.51   20.34   100.00   10.33   6300.00 

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Mercury, Hexavalent Chromium, Cadmium, PBBE or PBDE (5 of the 6 RoHS banned substances) in this or any of our other products.  

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.