Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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18 Non-hybrid devices found
Non-hybrid devices
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Weight [mg]
Cu [%]
Fe [%]
Ni [%]
Ag [%]
Zn [%]
Weight [mg]
Pb [%]
Ag [%]
Sn [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Cu [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
n/a
7440-50-8
7439-89-6
7440-02-0
7440-22-4
7440-66-6
n/a
7439-92-1
7440-22-4
7440-31-5
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
7440-50-8
n/a
n/a
NCP565D2T
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP565D2T12
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP565
NCP565D2T12G
Active
Y
89.50
10.50
529.31
99.70
0.30
340.51
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
909.21
NCP565D2T12R4
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP565
NCP565D2T12R4G
Active
Y
89.50
10.50
529.31
99.70
0.30
340.51
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
909.21
NCP565
NCP565D2T33G
Active
Y
89.50
10.50
529.31
99.70
0.30
340.51
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
909.21
NCP565
NCP565D2T33R4G
Active
Y
89.50
10.50
529.31
99.70
0.30
340.51
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
909.21
NCP565
NCP565D2TG
Active
Y
89.50
10.50
529.31
99.70
0.30
851.27
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
1419.97
NCP565D2TR4
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP565
NCP565D2TR4G
Active
Y
89.50
10.50
529.31
99.70
0.30
851.27
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
1419.97
NCP565
NCP565MN12T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565MN15T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565MN28T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565MN30T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565MN33T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565MNADJT2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP565
NCP565ST12T3G
Active
Y
89.50
10.50
59.70
96.20
2.40
1.30
0.10
37.17
75.00
25.00
2.37
100.00
7.44
100.00
3.30
100.00
0.01
109.99
NCP565ST33T3G
Obsolete
89.50
10.50
59.70
96.20
2.40
1.30
0.10
37.17
75.00
25.00
2.37
100.00
7.44
100.00
3.30
100.00
0.01
109.99
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .