Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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24 Non-hybrid devices found
Non-hybrid devices
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Weight [mg]
Cu [%]
Fe [%]
Ni [%]
Ag [%]
Zn [%]
P [%]
Weight [mg]
Pb [%]
Ag [%]
Sn [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Cu [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
n/a
7440-50-8
7439-89-6
7440-02-0
7440-22-4
7440-66-6
7723-14-0
n/a
7439-92-1
7440-22-4
7440-31-5
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
7440-50-8
n/a
n/a
NCP57152
NCP57152DSADJR4G
Active
Y
89.50
10.50
529.31
99.70
0.30
851.27
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
1419.97
NCP57152
NCP57152MNADJTYG
Active
Y
86.50
7.00
5.00
1.50
20.00
79.60
0.80
19.60
14.94
75.00
25.00
0.95
100.00
1.11
100.00
0.40
100.00
2.60
40.00
NCP571
NCP571MN08TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571MN08TXG
Obsolete
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCP571MN09TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571MN09TXG
Obsolete
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCP571MN10TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571MN10TXG
Obsolete
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCP571MN12TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571MN12TXG
Obsolete
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCP571SN08T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCP571SN09T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCP571SN10T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCP571SN12T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP57152
NCV57152DSADJR4G
Active
Y
89.50
10.50
529.31
99.70
0.30
851.27
95.00
5.00
11.31
100.00
27.15
100.00
0.19
100.00
0.74
1419.97
NCP57152
NCV57152MNADJTYG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP571
NCV571MN08TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCV571MN09TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCV571MN10TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCV571MN12TBG
Active
Y
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP571
NCV571SN08T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCV571SN09T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCV571SN10T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP571
NCV571SN12T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
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1 - 24 of 24
[
1
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .