Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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17 Non-hybrid devices found
Non-hybrid devices
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Zn [%]
Cr [%]
Sn [%]
Weight [mg]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7440-47-3
7440-31-5
n/a
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP6922CBMTTXG
Active
Y
3.00
86.50
8.00
2.00
0.50
20.80
98.28
1.00
0.22
0.25
0.25
18.45
32.00
68.00
0.18
100.00
0.26
100.00
1.69
100.00
0.50
41.88
NCP6922CCMTTXG
Active
Y
3.00
86.50
8.00
2.00
0.50
20.80
98.28
1.00
0.22
0.25
0.25
18.45
32.00
68.00
0.18
100.00
0.26
100.00
1.69
100.00
0.50
41.88
NCP6922CDMTTXG
Active
Y
3.00
86.50
8.00
2.00
0.50
20.80
98.28
1.00
0.22
0.25
0.25
18.45
32.00
68.00
0.18
100.00
0.26
100.00
1.69
100.00
0.50
41.88
NCP6924
NCP6924AFCET1G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6924
NCP6924AFCHT1G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6924
NCP6924BFCHT1G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6924
NCP6924CFCHT1G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6924DFCHT1G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6924FFCHT1G
Product Preview
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6925
NCP6925AFCT1G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP6925
NCP6925AFCT2G
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP692
NCP692MN15T2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
NCP692
NCP692MN18T2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
NCP692
NCP692MN25T2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
NCP692
NCP692MN33T2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
NCP692
NCP692MN50T2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
NCP692
NCP692MNADJT2G
Active
Y
86.50
7.00
5.00
1.50
14.25
95.80
2.20
2.00
2.78
32.00
68.00
0.18
100.00
1.22
100.00
1.07
100.00
0.21
19.71
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .