Material Composition
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11 Non-hybrid devices found
Non-hybrid devices
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Ag [%]
Zn [%]
Cr [%]
Sn [%]
Weight [mg]
Ag [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
9003-35-4
60676-86-0
n/a
21645-51-2
1333-86-4
n/a
7440-50-8
7440-22-4
7440-66-6
7440-47-3
7440-31-5
n/a
7440-22-4
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP706ABMX300TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706A
NCP706AMX300TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706B
NCP706BMX295TAG
Product Preview
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706B
NCP706BMX300TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706MX175TAG
Product Preview
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706MX180TAG
Product Preview
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706
NCP706MX21TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706
NCP706MX22TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706
NCP706MX295TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706
NCP706MX300TAG
Active
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
NCP706
NCP706MX33TAG
Product Preview
Y
3.00
86.50
8.00
2.00
0.50
1.14
98.28
1.00
0.22
0.25
0.25
1.09
75.00
25.00
0.05
100.00
0.07
100.00
0.13
100.00
0.07
2.55
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1 - 11 of 11
[
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .