Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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16 Non-hybrid devices found
Non-hybrid devices
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[
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Zn [%]
Cr [%]
P [%]
Sn [%]
Weight [mg]
Ag [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Pb [%]
Pd [%]
Au [%]
Ni [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7440-47-3
7723-14-0
7440-31-5
n/a
7440-22-4
1344-28-1
129915-35-1
n/a
7440-31-5
7439-92-1
7440-05-3
7440-57-5
7440-02-0
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCS2200A
NCS2200AMUT1G
Active
Y
86.50
7.00
5.00
1.50
10.00
99.28
0.22
0.25
0.25
6.97
32.00
68.00
0.45
3.20
1.10
95.70
0.71
100.00
0.20
100.00
1.67
20.00
NCS2200SN1T1
Obsolete
89.50
10.50
5.30
96.80
2.60
0.40
0.20
7.69
75.00
25.00
0.49
80.00
20.00
0.30
100.00
0.14
100.00
0.08
14.00
NCS2200
NCS2200SN1T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCS2200SN1T1GH
Active
Y
89.50
10.50
5.30
96.80
2.60
0.40
0.20
7.69
75.00
25.00
0.49
100.00
0.30
100.00
0.14
100.00
0.08
14.00
NCS2200SN2T1
Obsolete
89.50
10.50
5.30
96.80
2.60
0.40
0.20
7.69
75.00
25.00
0.49
80.00
20.00
0.30
100.00
0.14
100.00
0.08
14.00
NCS2200
NCS2200SN2T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCS2200SQ1T2
Obsolete
89.50
10.50
10.00
33.60
63.50
2.90
2.40
75.00
25.00
0.15
80.00
20.00
0.13
100.00
0.67
100.00
0.08
13.43
NCS2200SQ1T2G
Product Preview
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCS2200SQ2T2
Obsolete
89.50
10.50
10.00
33.60
63.50
2.90
2.40
75.00
25.00
0.15
80.00
20.00
0.13
100.00
0.67
100.00
0.08
13.43
NCS2200
NCS2200SQ2T2G
Active
Y
89.50
10.50
10.00
33.60
63.50
2.90
2.40
75.00
25.00
0.15
100.00
0.13
100.00
0.67
100.00
0.08
13.43
NCS2200SQ2T2GH
Active
Y
89.50
10.50
10.00
33.60
63.50
2.90
2.40
75.00
25.00
0.15
100.00
0.13
100.00
0.67
100.00
0.08
13.43
NCS2200SQLT1
Last Shipments
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
90.00
10.00
0.71
100.00
0.20
100.00
1.67
20.00
NCS2200
NCS2200SQLT1G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
98.28
1.00
0.22
0.25
0.25
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.39
100.00
1.67
20.19
NCS2200
NCV2200SN1T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCS2200
NCV2200SN2T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCS2200
NCV2200SQ2T2G
Active
Y
89.50
10.50
10.00
33.60
63.50
2.90
2.40
75.00
25.00
0.15
100.00
0.13
100.00
0.67
100.00
0.08
13.43
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .