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Part Number = BAS16

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20774Z Henkel Green Compound Qual for SC88, SC88A, SC70, SC74, SC75, SOD923 pkgs 2015-03-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20487ZA Final Notification of SOT-553 & SOT- 563 pkgs/devices qual for ASY&TST in LPS 2015-01-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20487 Final Notification of SOT-553 & SOT- 563 pkgs/devices qual for ASY&TST in LPS 2014-09-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16725 3Q11 Product Discontinuance Notice 2011-09-30 PRODUCT DISCONTINUANCE View PDF
16547O Copper Wire replacing Gold Wire in the SOT563, SOT553, SOT223(Soft Solder), SOD323, SC88, SC89, SOT723, SOD923, SOT963, SOT953 and SOT1123 packages 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16478O Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. 2010-05-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16452 1Q10 Product Discontinuance Notice 2010-04-14 PRODUCT DISCONTINUANCE View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16352 Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88 Packages 2009-10-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16266 Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages 2009-06-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16049 Final Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-10-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
16009 Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-05-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15694 4Q06 Product Discontinuance Notice 2007-01-02 PRODUCT DISCONTINUANCE View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
15590 2Q06 (2nd QUARTER 2006) Product Discontinuance Notice 2006-06-30 PRODUCT DISCONTINUANCE View PDF
15573 Final Notification for manufacturing expansion to Leshan China for the SC74 & SC75 packages 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15314 Initial Notification of the manufacturing expansion to Leshan, China for the SC74 & SC75 packages 2006-02-03 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12898 Qualification of Additional Assembly/Test Site for ON Semiconductor Devices Packaged in SC70 2003-07-11 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12929 SOT-553/SOT-563 2MM Carrier Pitch Carrier Tape Design Improvement 2003-05-21 PRODUCT BULLETIN View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12086 Final Notification - Assembly/Test Site Change for SC75 Package 2001-11-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11626 Final Notification - Assembly/Test Site Change for SC75 Package 2001-11-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10542 SOT23 Assembly/Test Qualification at KEC-T 2000-12-27 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10339 SOT23/SC59 Part Number Change 2000-10-23 PRODUCT BULLETIN View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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