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Part Number = BAS19L

PCN #

Title

Issued

Тип

Поступок

16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16049 Final Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-10-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16009 Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-05-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15590 2Q06 (2nd QUARTER 2006) Product Discontinuance Notice 2006-06-30 PRODUCT DISCONTINUANCE View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15503 1QO6 (1st QUARTER 2006) Product Discontinuance Notice 2006-04-12 PRODUCT DISCONTINUANCE View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
14240 Cancellation of: Initial Notification #14094 - Die Redesign For Small Signal Device Lines 2005-07-22 UPDATE NOTIFICATION View PDF
14094 Initial Notification - Die Redesign for Small Signal Device Lines 2005-05-26 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11148 Final Notification for SOT23 Capacity Expansion to PSI 2001-07-04 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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