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Part Number = CAT24C16

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20695 4Q2014 Product Discontinuance Notice 2015-01-20 PRODUCT DISCONTINUANCE View PDF
20395 1Q2014 Product Discontinuance Notice 2014-04-05 PRODUCT DISCONTINUANCE View PDF
20392 Qualification of ONC18EE process technology for EEPROM Memory fabrication at ON Semiconductor’s Gresham, Oregon. 2014-04-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20289 Update to IPCN20289 - Qual ATP as alt source for SOIC 8lds using Cu wire 2014-03-07 UPDATE NOTIFICATION View PDF
20342 Update to FPCN20342 - Qualify AMKOR as alternate supplier of packages UDFN8-2X3, WDFN8-2X3 for listed devices 2014-01-28 UPDATE NOTIFICATION View PDF
20342 Qualify AMKOR as alternate supplier of packages UDFN8-2X3, WDFN8-2X3 for listed devices 2013-12-28 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20289 Qualify ATP as alternate source for SOIC 8lds using Cu wire for ONC35EE wafer technology. 2013-12-04 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20231 3Q2013 Product Discontinuance Notice 2013-10-10 PRODUCT DISCONTINUANCE View PDF
16746 Deleted the Sleeve (Tube) device name from the PB16746 which change packing standard by removing protective band from plastic reel at ON Semiconductor (Thailand). 2012-03-22 UPDATE NOTIFICATION View PDF
16746 Change packing standard by removing protective band from plastic reel at ON Semiconductor (Thailand). 2012-01-25 PRODUCT BULLETIN View PDF
16629 Packaging change for 7” Reels 2011-04-26 PRODUCT BULLETIN View PDF
16506 Consolidation of production month code for marking 2010-08-19 PRODUCT BULLETIN View PDF
16476O Qualification of Serial I2C EEPROM devices CAT24C04, CAT24C08, CAT24C16, CAT24C32 and CAT24C64 for fabrication at ON Semiconductor’s Gresham, Oregon Wafer Fab, and marking updates for product using Gresham die, to differentiate from product using the current OKI Semiconductor die. 2010-05-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16362 Update Notification for Assembly/Test Site for former Catalyst products 2009-11-20 UPDATE NOTIFICATION View PDF
16264 TSSOP package -bottom marking elimination 2009-05-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
33220 CATALYST GROUP: All SOIC 8-lead devices with NiPdAu Termination Finish 2009-03-23 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
33221 CATALYST GROUP:All devices in SOIC and PDIP packages 2009-03-23 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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