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Part Number = CS8182

PCN #

Title

Issued

Тип

Поступок

16906 3Q2012 Product Discontinuance Notice 2012-10-10 PRODUCT DISCONTINUANCE View PDF
16830 1Q2012 Product Discontinuance Notice 2012-03-30 PRODUCT DISCONTINUANCE View PDF
16290 CARSEM to Seremban D2PAK and TO220 Assembly Transfer 2009-06-23 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16222 CARSEM to Seremban D2PAK and TO220 Assembly Transfer 2009-02-20 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16089 DPAK Package Mold Compound Change – Analog 2008-01-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16041 DPAK Package Mold Compound Change 2007-08-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
13517 Transfer of Analog Bipolar Wafer Fab from East Greenwich (USA) to Roznov (Czech Republic) 2004-07-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13298 Initial Notification for Transfer of Analog Bipolar Integrated Circuits Die Manufacturing 2004-01-27 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12738 Use of Winged Crimp Design for SOIC Narrow Body Shipping Tubes 2003-02-07 PRODUCT BULLETIN View PDF
12448 Assembly Transfer of Narrow Body SOIC Packaged Analog Devices to ON Semiconductor Phillipines (OSPI) 2002-09-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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