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Part Number = CS8361

PCN #

Title

Issued

Тип

Поступок

16830 1Q2012 Product Discontinuance Notice 2012-03-30 PRODUCT DISCONTINUANCE View PDF
16570 Shipping Tube change for SOIC Wide Body (SOIC WB) devices at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16290 CARSEM to Seremban D2PAK and TO220 Assembly Transfer 2009-06-23 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16222 CARSEM to Seremban D2PAK and TO220 Assembly Transfer 2009-02-20 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12511 Wafer Capacity Expansion for Selected 50V Analog Products in ON Semiconductor's Czech Republic facility 2003-06-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12556 Update to FPCN#12449 2002-09-13 UPDATE NOTIFICATION View PDF
10867 Dry Packed Parts Labeling Quality Improvement 2001-03-13 PRODUCT BULLETIN View PDF
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