| PD20836A |
1Q2015 Product Discontinuance Notice |
2015-04-17 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 20349 |
Qualification of Niigata Fab (Japan) as the additional wafer source for Bipolar Power Planar Transistors. |
2014-06-20 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20349 |
Qualify Niigata FAB (Japan) for Bipolar Power Planar, BPT and GPT |
2014-01-24 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20210A |
Assy & Test Qualification of OSV for FET, Ultrafast & Bipolar packaged in DPAK |
2013-09-24 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16725 |
3Q11 Product Discontinuance Notice |
2011-09-30 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16676 |
Qualification of Nantong Huada Microelectronics Group Co. Ltd. for Assembly and Test of TO-220 Bipolar Power Transistors and Rectifiers. |
2011-07-13 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16586 |
Qualification of Nantong Fujitsu Microelectronics Co.,Ltd. for Assembly/Test of DPAK (TO-252) Bipolar Power Transistors, Power Schottky and Ultrafast Rectifiers. |
2011-03-03 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16538 |
Special Leaded Product Discontinuance Notice |
2010-11-23 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16520 |
Qualification of MingXin Microelectronics Ltd. for Assembly/Test of DPAK (TO-252) Bipolar Power Transistors and Ultrafast Rectifiers. |
2010-09-16 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16477 |
Final Notification for Transfer of the Low Voltage Bipolar Planar and EMI Filters from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2010-06-09 |
UPDATE NOTIFICATION |
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PDF |
| 16486 |
DPAK Package Case Outline Standardization to match JEDEC and Industry |
2010-06-09 |
PRODUCT BULLETIN |
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PDF |
| 16477 |
Final Notification for Transfer of the Low Voltage Bipolar Planar and EMI Filters from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2010-06-02 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16452 |
1Q10 Product Discontinuance Notice |
2010-04-14 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16389 |
4Q09 (4th QUARTER 2009) Product Discontinuance Notice |
2010-01-21 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16287 |
1H2009 (First Half 2009) Leaded Parts to Lead Free Parts and Other Special Circumstance Parts Product Discontinuance Notice/EOL |
2009-06-19 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16250 |
Initial Notification of Transfer of EMI Filters, Bidirectional ESD Diodes, Bipolar Power, Bidirectional TVS (Transient Voltage Suppressor) Diodes, TVS (Transient Voltage Suppressor) Arrays, Small Signal Schottky, Ultrafast Rectifier and Thyristor Surge Protection Devices (TSPD) products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2009-04-29 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16100 |
Dpak Package Mold Compound Change – Discrete Products |
2008-02-26 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16041 |
DPAK Package Mold Compound Change |
2007-08-30 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16035 |
Final Notification of Qualification of Nantong-Fujitsu Microelectronics for Assembly/Test of TO-220AB Bipolar Power Transistors |
2007-08-22 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15694 |
4Q06 Product Discontinuance Notice |
2007-01-02 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15645 |
3rd QUARTER 2006 Product Discontinuance Notice |
2006-10-06 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15532 |
45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180 |
2006-05-15 |
UPDATE NOTIFICATION |
View
PDF |
| 15503 |
1QO6 (1st QUARTER 2006) Product Discontinuance Notice |
2006-04-12 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 13977 |
1Q05 (1ST QUARTER 2005) Product Discontinuance Notice |
2005-03-31 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 13317 |
Phase#3 Die Design Change (Die Shrink) for Bipolar Power Products |
2004-02-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13135 |
Phase#1 Die Design Change (Die Shrink) for Bipolar Power Products |
2003-09-30 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12868 |
Initial Notification for Design Change on Bipolar Power Products |
2003-04-25 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 11967 |
Final Notification for DPAK Package Manufactured with a Single Gauge Leadframe |
2002-05-28 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 11594 |
Final Notification - Phase#2 - Bipolar Power Fab Transfer TLS-BP6 to PHX- |
2001-07-31 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10863 |
Initial Notification for Bipolar Power Wafer Fab Transfer from Toulouse, France to Phoenix, Arizona |
2001-03-13 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10156 |
D-PAK Conversion to C008 Flashless Leadframe |
2000-03-27 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4794 |
Alternate Cover Tape Supplier for D-PAK Tape/Reel Devices |
1999-06-08 |
PRODUCT BULLETIN |
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PDF |
| 4601 |
Update to 4590 - Sector Materials Org. (SMO) Closure (Part 2 of 8) |
1999-04-14 |
UPDATE NOTIFICATION |
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PDF |
| 4590 |
Sector Materials Organization (SMO) Closure (Part 2 of 8) |
1999-04-04 |
PRODUCT BULLETIN |
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PDF |