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Part Number = DTC124EE

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20774Z Henkel Green Compound Qual for SC88, SC88A, SC70, SC74, SC75, SOD923 pkgs 2015-03-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20349A Qualification of Niigata Fab (Japan) as the additional wafer source for Small Signal General Purpose Transistors and Bias Resistor Transistors 2014-11-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16352 Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88 Packages 2009-10-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
15573 Final Notification for manufacturing expansion to Leshan China for the SC74 & SC75 packages 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15314 Initial Notification of the manufacturing expansion to Leshan, China for the SC74 & SC75 packages 2006-02-03 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12086 Final Notification - Assembly/Test Site Change for SC75 Package 2001-11-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11626 Final Notification - Assembly/Test Site Change for SC75 Package 2001-11-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10184 New Source of Cover Tape Qualified 2000-05-30 PRODUCT BULLETIN View PDF
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