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Part Number = LM317

PCN #

Title

Issued

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20122 Update Notice to FPCN 20122 - Capacity expansion for SOIC08 Copper Wire Products into ASE Kunshan, China 2013-07-23 UPDATE NOTIFICATION View PDF
20122 Capacity expansion for SOIC08 Copper Wire Products into ASE Kunshan, China 2013-07-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16630 Update to the FPCN Dual source LM317 and NCV317 in EPI44 and ON50 Process Technology 2011-08-10 UPDATE NOTIFICATION View PDF
16678O IC D2PAK 3 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK 2011-07-15 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16630O Dual source LM317 and NCV317 in EPI44 and ON50 Process Technology 2011-05-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16572 Dual source LM317 and NCV317 in EPI44 and ON50 process technology 2011-02-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16571 Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16486 DPAK Package Case Outline Standardization to match JEDEC and Industry 2010-06-09 PRODUCT BULLETIN View PDF
16452 1Q10 Product Discontinuance Notice 2010-04-14 PRODUCT DISCONTINUANCE View PDF
16396 IC D2PAK 3 AND 5 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK 2010-02-12 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16287 1H2009 (First Half 2009) Leaded Parts to Lead Free Parts and Other Special Circumstance Parts Product Discontinuance Notice/EOL 2009-06-19 PRODUCT DISCONTINUANCE View PDF
16227 Copper Wire in SOIC and TSSOP packaged Products 2009-05-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16231 Copper Wire in SOT223 packaged Products 2009-03-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16212 Move of IC T092 Assembly and Test to Dalian, China 2009-02-05 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16112 Move of IC T092 Assembly and Test to Dalian, China 2008-04-10 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16089 DPAK Package Mold Compound Change – Analog 2008-01-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16041 DPAK Package Mold Compound Change 2007-08-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
16024 DUAL SOURCING OF SELECTED DEVICES AT ONPY1 IN SLOVAKIA 2007-06-20 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15715 DUAL SOURCING OF SELECTED DEVICES AT ONPY1 IN SLOVAKIA 2007-01-29 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15550 FINAL NOTICE FOR IC T0220 PACKAGE CHANGE TO SINGLE GAGE HEATSINK 2006-05-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15212 Pb-free Conversion - Backward Compatibility 2005-12-28 GENERAL ANNOUNCEMENT View PDF
15018 Initial notice for IC T0220 package change to Single Gage heatsink 2005-09-15 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13564 Qualification of D2PAK Packages at ON Semi Seremban 2004-08-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13462 Qualification of T0220 Packages at ON Semi Seremban 2004-05-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13276 Qualification of T0220 and D2PAK Packages at ON Semi Seremban 2003-12-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12816 Qualification of Modified Leadframe Design for Analog 3 Lead D2PAK Package 2003-07-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12875 SOT223 Analog Alternative Capacity in Seremban 2003-06-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11329 Final Notification for Transferring the SOT-223 Package to Psi 2001-10-12 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11945 3ld Dpak Single Gauge Leadframe Qual at Internal and External 2001-10-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10147 Update Notification for PCNs 4813 and 10041 2000-03-08 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10044 Transfer from BMC/BP4 to Tesla of Analog Devices 1999-09-17 UPDATE NOTIFICATION View PDF
10001 New Mask Set for LM317T/D2T from Tesla 1999-08-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4958 Transfer of 3 Lead Surface Mount (D2T) Package to Tesla 1999-07-30 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4813 Transfer from BMC/BP4 to Tesla of Analog Devices 1999-06-18 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4529 Addendum to PCN#4396:Assembly/Test Site Change to Seremban, Malaysia 1999-03-12 PRODUCT BULLETIN View PDF
4436 Analog IC DPACK Assembly/Site Qualification for PSI Phillipines 1999-02-09 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4323 EOL for Various Analog Devices 1999-02-08 PRODUCT DISCONTINUANCE View PDF
4396 Assembly/Test Site Change to Seremban, Malaysia 1999-01-21 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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