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Уведомление об обновлениях схем

Change Notification #   20889B
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   WLP fab site change from Gunma, Japan to Niigata, Japan
Issue Date   2015-06-04
Affected Product Family  
Description   To continuously supply products and increase our supply capacity to support increased demand, the Wafer level package location will move from Gunma, Japan to Niigata, Japan. Most equipment and personnel will be transferred from the Gunma to the Niigata site. The Niigata site is ISO/TS16949 certified. Neither change in electrical characteristics, nor product reliably is expected.
Key Items Affected by Change   Manufacturing Site
 
Key Milestones  
Effective Date:   2016-02-15
Sample Info:   Contact your local ON Semiconductor Sales Office or Makoto.Nakaoka@onsemi.com
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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