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Part Number = MC100EL30

PCN #

Title

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Тип

Поступок

16161 Update to the Final Notification for transfer of M35 and M5 products from COM1 wafer fab (Phoenix, AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2011-02-01 UPDATE NOTIFICATION View PDF
16570 Shipping Tube change for SOIC Wide Body (SOIC WB) devices at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13416 Wafer Fabrication Site Transfer for Selected Product Families to the COM1 Facility 2004-04-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12581 Final Notification for IPCN#11369 - Wafer Capacity Addition for MOSAIC 3 Technology - Group 1, Phase 1 2002-10-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12049 Update to IPCN#11369, Wafer Capacity Addition for MOSAIC3 Technology 2001-11-19 UPDATE NOTIFICATION View PDF
11369 Initial Notification for Wafer Capacity Addition for MOSAIC3 Technology 2001-04-18 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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