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Part Number = MC100LVEP05

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20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16063 Addition of ON Semiconductor Seremban Assembly/Test Site for High Frequency, 8 Lead TSSOP Package 2007-10-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16014 Transfer of High Frequency, 8 Lead TSSOP Package to ON Semiconductor Seremban Assembly/Test Site 2007-05-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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