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Part Number = MC100LVEP34

PCN #

Title

Issued

Тип

Поступок

20301 4Q2013 Product Discontinuance Notice 2013-12-20 PRODUCT DISCONTINUANCE View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16022 Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes 2007-07-26 PRODUCT BULLETIN View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
13212 Assembly/Test Site Capacity Addition for Clock and Data Management Products in the 16 Lead SOIC Narrow Body Package 2003-12-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12052 Update to IPCN# 11335, Wafer Capacity Addition for MOSAIC5 Technology 2001-11-17 UPDATE NOTIFICATION View PDF
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