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PCN Search Results

Part Number = MC10EP89

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20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16063 Addition of ON Semiconductor Seremban Assembly/Test Site for High Frequency, 8 Lead TSSOP Package 2007-10-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16014 Transfer of High Frequency, 8 Lead TSSOP Package to ON Semiconductor Seremban Assembly/Test Site 2007-05-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15156 Family Specification Update for MC10SX1189, MC10SX1190, and 10EP89 2005-12-03 PRODUCT BULLETIN View PDF
13846 Seremban Assembly/Test Site Addition for HF & Signal Products in 8 Lead TSSOP Package 2004-12-09 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13024 Assembly/Test Site Capacity Addition for Clock and Data Management Products in the 8 Lead SOIC Narrow Body Package 2003-08-27 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12533 Sumitomo Mold Compound Change on TSSOP and Zener Array Packages 2002-08-30 PRODUCT BULLETIN View PDF
12052 Update to IPCN# 11335, Wafer Capacity Addition for MOSAIC5 Technology 2001-11-17 UPDATE NOTIFICATION View PDF
11335 Initial Notification for Wafer Capacity Addition for MOSAIC5 Technology 2001-04-12 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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