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Part Number = MC33204

PCN #

Title

Issued

Тип

Поступок

20848 Capacity expansion for TSSOP14/16 Products into ASE Kunshan, China. 2015-05-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16571 Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16452 1Q10 Product Discontinuance Notice 2010-04-14 PRODUCT DISCONTINUANCE View PDF
16227 Copper Wire in SOIC and TSSOP packaged Products 2009-05-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16022 Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes 2007-07-26 PRODUCT BULLETIN View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10102 Transfer of Analog DBL Layer Metal EPI85/92 Devices from BP4 to Tesla 1999-12-20 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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