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Part Number = MC33363A

PCN #

Title

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Тип

Поступок

16923 Phase 1 Copper Wire for VHVIC Products in SOIC and TSSOP packages in Carmona, Philippines 2012-10-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16855 VHVIC 2nd Source Qualification to Gresham FAB – Phase 3 2012-06-05 UPDATE NOTIFICATION View PDF
16855 VHVIC 2nd Source Qualification to Gresham FAB – Phase 3 2012-05-11 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16570 Shipping Tube change for SOIC Wide Body (SOIC WB) devices at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16524 VHVIC 2nd Source Qualification to Gresham FAB 2010-09-22 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16523 Update Notification to Product Discontinuance #16389 2010-09-16 UPDATE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
15747 Qualification of OSPI for Assembly/Test of 8/14/16/20/24/28 Lead SOIC Wide and Narrow Body Packages 2007-03-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12740 Qualification of Additional VHVIC Devices at the Aizu, Japan Facility. 2003-02-18 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10133 MOS7 Qualification for VHVIC (Very High Voltage IC) Die Manufacturing 2000-02-02 PRODUCT BULLETIN View PDF
4815 Qualification of MOS7 for Additional VHVIC (Very High Voltage Integrated Circuits) Wafer Capacity 1999-06-16 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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