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Part Number = MC74AC253

PCN #

Title

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Тип

Поступок

16582 Update to FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel) - FPCN16582 (SOIC Package) and FPCN16582A (TSSOP Package) 2012-07-13 UPDATE NOTIFICATION View PDF
16582 Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel) 2011-12-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16582 Initial Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel). 2011-03-16 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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