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Part Number = MC74HC4316A

PCN #

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20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16784 4Q2011 Product Discontinuance Notice 2012-01-27 PRODUCT DISCONTINUANCE View PDF
16622A Capacity expansion for SOIC14-16 Copper Wire Products into ASE Kunshan, China 2011-12-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16300 Final Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To Tower Semiconductor Ltd. (Israel) 2009-07-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16178 Initial Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to Tower Semiconductor Israel. 2008-12-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
15532 45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180 2006-05-15 UPDATE NOTIFICATION View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12961 Qualification of Renesas Electronics for 14/16 LEAD PDIP Package for Select MC14XXXBCP and MC74HC/HCTXXXAN Devices 2003-06-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12274 Final Notification Of High Speed Logic Family Migration 2002-06-17 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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