PCN Search Results
Part Number = MC74LCX16240
| 16218 |
TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm |
2009-02-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16210 |
2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & |
2009-02-11 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15694 |
4Q06 Product Discontinuance Notice |
2007-01-02 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15199 |
Pb Free (Lead Free) Part Number 16 Character Nomenclature Set-Up |
2005-12-21 |
PRODUCT BULLETIN |
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PDF |
| 14188 |
PB Free (Lead Free) Part Number Set-Up Corrections |
2005-07-02 |
PRODUCT BULLETIN |
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PDF |
| 13642 |
Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products |
2004-09-09 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13157 |
Addition of Tower Fab for Minigate, LCX, VHC, FST and Analog Switch Products |
2003-10-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12434 |
Standard Components Low Sales Devices Product Discontinuance |
2002-05-09 |
PRODUCT DISCONTINUANCE |
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PDF |
| 12048 |
Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification |
2002-01-11 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10541 |
24/48 Lead TSSOP Transfer from Amkor, Korea to AIT, Indonesia |
2000-12-27 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10180 |
48LD TSSOP 3-Layer Pre-Plated Lead Frame |
2000-04-27 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10052 |
Deleting LCX Toshiba Die from Finish Goods Bill of Material |
1999-10-25 |
PRODUCT BULLETIN |
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PDF |
| 4882 |
LCX Process Flow Change |
1999-07-26 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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