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Part Number = MC74LVX240

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16830 1Q2012 Product Discontinuance Notice 2012-03-30 PRODUCT DISCONTINUANCE View PDF
16784 4Q2011 Product Discontinuance Notice 2012-01-27 PRODUCT DISCONTINUANCE View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16080 FPCN SOIC WB EXPANSION FOR OSPI 2007-12-18 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15747 Qualification of OSPI for Assembly/Test of 8/14/16/20/24/28 Lead SOIC Wide and Narrow Body Packages 2007-03-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13886 Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products 2005-01-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13642 Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products 2004-09-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12467 Update Notice for #12434: Standard Components Low Sales Devices Product Discontinuance 2002-06-12 UPDATE NOTIFICATION View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10770 Addition of Tower Semiconductor as a Qualified Wafer Fabrication Site 2001-03-14 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4884 Addition of Chartered Semconductor as a Qualified Wafer Fabrication Site for VHC and LVX Devices 1999-07-01 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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