| 16784 |
4Q2011 Product Discontinuance Notice |
2012-01-27 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16569 |
4Q10 Product Discontinuance Notice |
2011-01-24 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16218 |
TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm |
2009-02-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16140 |
H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-08-20 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16080 |
FPCN SOIC WB EXPANSION FOR OSPI |
2007-12-18 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15747 |
Qualification of OSPI for Assembly/Test of 8/14/16/20/24/28 Lead SOIC Wide and Narrow Body Packages |
2007-03-13 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15621 |
Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages |
2006-07-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15532 |
45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180 |
2006-05-15 |
UPDATE NOTIFICATION |
View
PDF |
| 15511 |
FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN |
2006-04-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15333 |
Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL |
2006-02-01 |
UPDATE NOTIFICATION |
View
PDF |
| 15157 |
Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan |
2005-12-07 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15006 |
Intrinsic Lead (Pb) Free Product Part Number Change |
2005-08-30 |
PRODUCT BULLETIN |
View
PDF |
| 14235 |
Marking Type Change from Ink to Laser at ASECL |
2005-07-29 |
PRODUCT BULLETIN |
View
PDF |
| 13886 |
Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products |
2005-01-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13560 |
Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products |
2004-08-02 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
View
PDF |
| 13157 |
Addition of Tower Fab for Minigate, LCX, VHC, FST and Analog Switch Products |
2003-10-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12467 |
Update Notice for #12434: Standard Components Low Sales Devices Product Discontinuance |
2002-06-12 |
UPDATE NOTIFICATION |
View
PDF |
| 12434 |
Standard Components Low Sales Devices Product Discontinuance |
2002-05-09 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 12048 |
Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification |
2002-01-11 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10770 |
Addition of Tower Semiconductor as a Qualified Wafer Fabrication Site |
2001-03-14 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10111 |
Traceability Code Correction for PB 10100 |
2000-01-10 |
PRODUCT BULLETIN |
View
PDF |
| 10100 |
Date Code Format Change for MFP(SO EIAJ T2) |
1999-12-19 |
PRODUCT BULLETIN |
View
PDF |
| 10101 |
End of Life of Sticky Tape and Reel for MFP(SO EIAJ T2) Products (L1/L2/R1/R2) |
1999-12-19 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 10104 |
Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products |
1999-12-19 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4887 |
14/16/20L TSSOP 3-Layer Pre-Plated Frames |
1999-07-28 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4884 |
Addition of Chartered Semconductor as a Qualified Wafer Fabrication Site for VHC and LVX Devices |
1999-07-01 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4419 |
MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan |
1999-02-07 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |