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Part Number = MC74VHC4316

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16622B Capacity expansion for SOIC14-16 Copper Wire Products into ASE Kunshan, China 2012-01-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16725 3Q11 Product Discontinuance Notice 2011-09-30 PRODUCT DISCONTINUANCE View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16300 Final Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To Tower Semiconductor Ltd. (Israel) 2009-07-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16178 Initial Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to Tower Semiconductor Israel. 2008-12-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16022 Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes 2007-07-26 PRODUCT BULLETIN View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12274 Final Notification Of High Speed Logic Family Migration 2002-06-17 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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