feedback
Rate this webpage

Need
Support?


Уведомление об обновлениях схем

Change Notification #   20626
Revision   CB
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN for wire change from AU to CU, mold compound change & part number change
Issue Date   2014-12-26
Affected Product Family  
Description   This is a Final Process Change Notification to announce for below contents. 1) Changing wire material from gold to copper 2) Changing part number from XXXXXX-TL-H to XXXXXX-TL-W. (See the list of models)
Key Items Affected by Change   Assembly area- Wire Bonding and Mold compound and Part number change
 
Key Milestones  
Effective Date:   2015-04-02
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

Ранее просмотренные схемы
Очистить список

Техническая поддержка
   
 

Sign Up for Ongoing PCN Updates!
  ON Semiconductor has partnered with PCNAlert to provide product change and product update notification. This service will automatically notify you of time critical product change and obsolescence information. You can customize your preferences, so you only receive PCNs for products you specify.

This is a complimentary service from ON Semiconductor and PCNAlert.