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Part Number = MJD243

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20210A Assy & Test Qualification of OSV for FET, Ultrafast & Bipolar packaged in DPAK 2013-09-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16586 Qualification of Nantong Fujitsu Microelectronics Co.,Ltd. for Assembly/Test of DPAK (TO-252) Bipolar Power Transistors, Power Schottky and Ultrafast Rectifiers. 2011-03-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16520 Qualification of MingXin Microelectronics Ltd. for Assembly/Test of DPAK (TO-252) Bipolar Power Transistors and Ultrafast Rectifiers. 2010-09-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16477 Final Notification for Transfer of the Low Voltage Bipolar Planar and EMI Filters from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2010-06-09 UPDATE NOTIFICATION View PDF
16486 DPAK Package Case Outline Standardization to match JEDEC and Industry 2010-06-09 PRODUCT BULLETIN View PDF
16477 Final Notification for Transfer of the Low Voltage Bipolar Planar and EMI Filters from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2010-06-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16250 Initial Notification of Transfer of EMI Filters, Bidirectional ESD Diodes, Bipolar Power, Bidirectional TVS (Transient Voltage Suppressor) Diodes, TVS (Transient Voltage Suppressor) Arrays, Small Signal Schottky, Ultrafast Rectifier and Thyristor Surge Protection Devices (TSPD) products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-04-29 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16100 Dpak Package Mold Compound Change – Discrete Products 2008-02-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16041 DPAK Package Mold Compound Change 2007-08-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
13135 Phase#1 Die Design Change (Die Shrink) for Bipolar Power Products 2003-09-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12868 Initial Notification for Design Change on Bipolar Power Products 2003-04-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11967 Final Notification for DPAK Package Manufactured with a Single Gauge Leadframe 2002-05-28 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11594 Final Notification - Phase#2 - Bipolar Power Fab Transfer TLS-BP6 to PHX- 2001-07-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10863 Initial Notification for Bipolar Power Wafer Fab Transfer from Toulouse, France to Phoenix, Arizona 2001-03-13 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10156 D-PAK Conversion to C008 Flashless Leadframe 2000-03-27 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4794 Alternate Cover Tape Supplier for D-PAK Tape/Reel Devices 1999-06-08 PRODUCT BULLETIN View PDF
4601 Update to 4590 - Sector Materials Org. (SMO) Closure (Part 2 of 8) 1999-04-14 UPDATE NOTIFICATION View PDF
4590 Sector Materials Organization (SMO) Closure (Part 2 of 8) 1999-04-04 PRODUCT BULLETIN View PDF
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