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Part Number = MMBD6050L

PCN #

Title

Issued

Тип

Поступок

16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16049 Final Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-10-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16009 Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-05-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
10542 SOT23 Assembly/Test Qualification at KEC-T 2000-12-27 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10184 New Source of Cover Tape Qualified 2000-05-30 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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