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Part Number = MUN2211

PCN #

Title

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Тип

Поступок

20349A Qualification of Niigata Fab (Japan) as the additional wafer source for Small Signal General Purpose Transistors and Bias Resistor Transistors 2014-11-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20349 Qualify Niigata FAB (Japan) for Bipolar Power Planar, BPT and GPT 2014-01-24 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16352 Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88 Packages 2009-10-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16165 Final Notification for Gold wire changing to Copper wire on SOT-23 BRT parts 2008-10-14 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
15590 2Q06 (2nd QUARTER 2006) Product Discontinuance Notice 2006-06-30 PRODUCT DISCONTINUANCE View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15503 1QO6 (1st QUARTER 2006) Product Discontinuance Notice 2006-04-12 PRODUCT DISCONTINUANCE View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10339 SOT23/SC59 Part Number Change 2000-10-23 PRODUCT BULLETIN View PDF
10216 SOT23 Assembly/Test Transfer to LPS 2000-07-31 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10184 New Source of Cover Tape Qualified 2000-05-30 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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