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Part Number = NB4L16M

PCN #

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20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15174 Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban 2005-12-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15014 Released as 15011 - Seremban Assembly/Test Site Addition for Analog High Frequency 3x3 16-Lead QFN Package 2005-10-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15021 Update Notification for QFN Assembly at NSEB 2005-09-19 UPDATE NOTIFICATION View PDF
15011 Seremban Assembly/Test Site Addition for Analog High Frequency 3x3 16-Lead QFN Package 2005-09-01 PRODUCT BULLETIN View PDF
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