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Part Number = NCP2820

PCN #

Title

Issued

Тип

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20109 2Q2013 Product Discontinuance Notice 2013-07-23 PRODUCT DISCONTINUANCE View PDF
16971 Qualification of Deca Philippines for Bump Post-Test Production (Wafer saw, visual inspection, Tape and Reel) 2013-02-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16914 Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. 2012-10-05 PRODUCT BULLETIN View PDF
16830 1Q2012 Product Discontinuance Notice 2012-03-30 PRODUCT DISCONTINUANCE View PDF
16121 Qualification of UAT for Bumped Products 2008-05-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16116 Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for Devices Currently Fabricated at XFAB Wafer Foundries 2008-05-13 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16090 FPCN for Qualification of UDFN/UQFN 0.5mm Package Thickness (1.0x1.2mm to 3.0x3.0mm) at ON Semiconductor SBN and at UTAC (Bangkok, Thailand) 2008-01-14 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16055 Capacity Expansion for Devices Fabricated at XFAB Wafer Foundries 2007-10-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16045 Qualification of Flip Chip International (FCI) for Bumped Products 2007-09-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15676 Initial PCN for Qualification of UQFN / UDFN / LLGA 0.5mm package thickness 1x1mm to 3x3mm) at ON Seremban 2006-12-06 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
15336 Initial Notification of Qualification of Advance Semiconductor Engineering (Site K7) for Flipchip Assembly 2006-02-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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