Уведомление об обновлениях схем
| Change Notification # |
|
20346 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Installation of back grind production line in OSPI Carmona for products that get wafer probe and assembly operations in OSPI |
| Issue Date |
|
2014-09-09 |
| Affected Product Family |
|
|
| Description |
|
Products that currently get wafer probing and assembly in OSPI Carmona are shipped to a subcontractor for back grinding in between probing and assembly.
By installing the back grind capacity in OSPI we will reduce the cycle time, create extra capacity for back grinding and improve the quality by eliminating the non-added value shipping steps.
|
| Key Items Affected by Change |
|
Backgrind |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-12-15 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|