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Part Number = NIS5132

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20473A PCN Update Notice – Cancellation of FPCN20473 2014-09-09 UPDATE NOTIFICATION View PDF
20473 To correct the top mark code stated in FPCN20473 2014-08-01 UPDATE NOTIFICATION View PDF
20473 Addition of ASE China as qualified assembly sites for eFuse devices in DFN pkgs 2014-05-15 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16450 Final Notification for Capacity Expansion Qualification of ON Semiconductor Roznov, Czech Republic Wafer Fab (CZ4) for HD Plus Currently Fabricated at ON Semiconductor’s Aizu Japan Wafer Fab 2011-07-27 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16480 Final Notification for Capacity Expansion Qualification of ON Semiconductor Roznov, Czech Republic Wafer Fab (CZ4) for HD Plus Currently Fabricated at ON Semiconductor’s Aizu Japan Wafer Fab 2010-07-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16450 Capacity Expansion Qualification of ON Semiconductor Roznov, Czech Republic Wafer Fab (CZ4) for HD Plus Currently Fabricated at ON Semiconductor’s Aizu Japan Wafer Fab 2010-04-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16339 Qualification of UTAC, Bangkok, Thailand for Assembly/Test DFN10-3x3 for e-Fuse Products. 2009-09-21 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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