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PCN Search Results

Part Number = NLSF3T126

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20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
15174 Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban 2005-12-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15021 Update Notification for QFN Assembly at NSEB 2005-09-19 UPDATE NOTIFICATION View PDF
13751 Final PCN for Qualification of QFN (3.3MM TO 8X8MM, 6 TO 52-LD) at ASAT China 2004-12-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13716 Initial PCN for Qualification of QFN (2X2.2MM TO 8X8MM, 6 TO 52-LD) at ASAT China 2004-10-22 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13524 Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products 2004-07-14 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13432 Addition of ON Seremban as Assembly Site for 3X3 QFN Logic Products 2004-04-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13368 Qualification of 3X3 QFN (QUAD FLAT NO-LEAD) Package at NSEB 2004-03-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13296 Initial PCN for Qualification of QFN (2X2.2MM to 8X8MM, 6 to 52LD) at ON Seremban 2004-01-21 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13270 Initial PCN for Qualification of QFN (QUAD FLAT NO-LEAD) (2X2.2MM to 8X8MM, 6 to 52LD) at NSEB 2003-12-16 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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