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Part Number = NTD6416AN

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20395 1Q2014 Product Discontinuance Notice 2014-04-05 PRODUCT DISCONTINUANCE View PDF
20386 Qual of OSV for ASY&TST of TMOS, HD3E, HVFET, SCR and TRIAC packaged in DPAK 2014-02-20 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16539O Wafer Capacity Expansion at United Microelectronics Corporation (UMC) 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16486 DPAK Package Case Outline Standardization to match JEDEC and Industry 2010-06-09 PRODUCT BULLETIN View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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