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Уведомление об обновлениях схем

Change Notification #   16686
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Polyimide Passivation on PowerMOS Devices
Issue Date   2011-07-25
Affected Product Family  
Description   This Final Process Change Notification (FPCN) is being issued for Power MOSFET products. ON Semiconductor is presenting this notification for their customers to announce a wafer process change on their Trench3 silicon platform. For SO8 Flat Lead and Micro8 Flat Lead products, there will be a change with the Trench3 Die passivation scheme from a Teos-Silicon Nitride to a Polyimide. There will be no Electrical, Switching, and Dynamic performance difference. All Qualification and Reliability testing has been completed, and has passed all the required criteria.
Key Items Affected by Change   Power MOSFET Business Unit: Wafer Fabrication
 
Key Milestones  
Effective Date:   2011-10-25
Sample Info:   Contact your local ON Semiconductor Sales Office Brian Goodburn
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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