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Part Number = NUP2105

PCN #

Title

Issued

Тип

Поступок

16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16287 1H2009 (First Half 2009) Leaded Parts to Lead Free Parts and Other Special Circumstance Parts Product Discontinuance Notice/EOL 2009-06-19 PRODUCT DISCONTINUANCE View PDF
16266 Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages 2009-06-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16237 Final Notification for Transfer of Zener Products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-04-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16054 Qualification of ON Semiconductor Seremban Wafer Fab as Secondary Source for 2007-10-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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