Уведомление об обновлениях схем
| Change Notification # |
|
10123 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
SOT223 Epoxy Die Attach |
| Issue Date |
|
2000-01-26 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
Small Signal SOT223 product with die sizes of 32x32 mils and larger will convert from a Eutectic Die Attach process to an Epoxy Die Attach process enhancing product quality during board mount assembly. As a part of the design improvement, the SOT223 leadframe is being modified to add additional mold lock features, and the wafer back metal process is converted from a Sinter process to an Alloy process.
|
| Key Items Affected by Change |
|
Assembly Process Wafer Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2000-03-26 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|