feedback
Rate this webpage

Need
Support?


Уведомление об обновлениях схем

Change Notification #   10123
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   SOT223 Epoxy Die Attach
Issue Date   2000-01-26
Affected Product Family   DISCRETES AND LOGIC
Description   Small Signal SOT223 product with die sizes of 32x32 mils and larger will convert from a Eutectic Die Attach process to an Epoxy Die Attach process enhancing product quality during board mount assembly. As a part of the design improvement, the SOT223 leadframe is being modified to add additional mold lock features, and the wafer back metal process is converted from a Sinter process to an Alloy process.
Key Items Affected by Change   Assembly Process Wafer Process
 
Key Milestones  
Effective Date:   2000-03-26
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

Ранее просмотренные схемы
Очистить список

Техническая поддержка
   
 

Sign Up for Ongoing PCN Updates!
  ON Semiconductor has partnered with PCNAlert to provide product change and product update notification. This service will automatically notify you of time critical product change and obsolescence information. You can customize your preferences, so you only receive PCNs for products you specify.

This is a complimentary service from ON Semiconductor and PCNAlert.