Уведомление об обновлениях схем
| Change Notification # |
|
10191 |
| Revision |
|
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| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Emboss Tape and Reel Material Change for MFP (SO EIAJ T2)/TSSOP Products Correction for PCN 10104 |
| Issue Date |
|
2000-06-27 |
| Affected Product Family |
|
ANALOG |
| Description |
|
ON Semiconductor is announcing the correction to the Product/Process Change Notification 10104 EMBOSS TAPE AND REEL MATERIAL CHANGE FOR MFP (SO EIAJ T2)/TSSOP PRODUCTS. We would like to stop changing the reel material for 8LD MFP (SO EIAJ T2) 1,000 pcs roll, we continue to use the current Cardboard Reel made by Shinetsu. Furthermore we would like to postpone the start date for changing all materials for 8LD MFP(SO EIAJ T2) to July 2000.
- Continue to use 250mm Diameter Cardboard Reel made by Shinetsu Polymer.
- Will change the materials for 8LD MFP(SO EIAJ T2) in July 2000.
|
| Key Items Affected by Change |
|
|
| |
| Key Milestones |
|
| Effective Date: |
|
2000-06-28 |
| Sample Info: |
|
N/A |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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