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Уведомление об обновлениях схем

Change Notification #   10191
Revision  
Type of Notification   UPDATE NOTIFICATION
Change Title   Emboss Tape and Reel Material Change for MFP (SO EIAJ T2)/TSSOP Products Correction for PCN 10104
Issue Date   2000-06-27
Affected Product Family   ANALOG
Description   ON Semiconductor is announcing the correction to the Product/Process Change Notification 10104 EMBOSS TAPE AND REEL MATERIAL CHANGE FOR MFP (SO EIAJ T2)/TSSOP PRODUCTS. We would like to stop changing the reel material for 8LD MFP (SO EIAJ T2) 1,000 pcs roll, we continue to use the current Cardboard Reel made by Shinetsu. Furthermore we would like to postpone the start date for changing all materials for 8LD MFP(SO EIAJ T2) to July 2000.
- Continue to use 250mm Diameter Cardboard Reel made by Shinetsu Polymer.
- Will change the materials for 8LD MFP(SO EIAJ T2) in July 2000.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2000-06-28
Sample Info:   N/A
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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