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Уведомление об обновлениях схем

Change Notification #   16035
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Final Notification of Qualification of Nantong-Fujitsu Microelectronics for Assembly/Test of TO-220AB Bipolar Power Transistors
Issue Date   2007-08-22
Affected Product Family  
Description   This is the second FPCN to IPCN 15671 that announced the planned capacity expansion of ON Semiconductor’s assembly and test operation of TO-220AB and I2PAK discrete packaged products, currently built at the PSI Manila facility to Nantong-Fujitsu’s China facility. Upon expiration of this FPCN, these non-automotive Bipolar Power TO-220AB devices may be built at either location. The Nantong-Fujitsu facility is currently used to manufacture ON Semiconductor’s DPAK and Schottky Rectifier TO-220AB devices and is ISO/TS 16949:2002 certified. There are minor changes to ON Semiconductor case outline 221A-09, including F dimension (Hole diameter) change from 3.73mm max to 4.09mm max (in accordance with JEDEC max).
Key Items Affected by Change   ON Semiconductor Assembly and Test Site
 
Key Milestones  
Effective Date:   2007-11-22
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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