Уведомление об обновлениях схем
| Change Notification # |
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16035 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Final Notification of Qualification of Nantong-Fujitsu Microelectronics for Assembly/Test of TO-220AB Bipolar Power Transistors |
| Issue Date |
|
2007-08-22 |
| Affected Product Family |
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| Description |
|
This is the second FPCN to IPCN 15671 that announced the planned capacity expansion of
ON Semiconductor’s assembly and test operation of TO-220AB and I2PAK discrete packaged products, currently built at the PSI Manila facility to Nantong-Fujitsu’s China facility.
Upon expiration of this FPCN, these non-automotive Bipolar Power TO-220AB devices may be built at either location.
The Nantong-Fujitsu facility is currently used to manufacture ON Semiconductor’s DPAK and Schottky Rectifier TO-220AB devices and is ISO/TS 16949:2002 certified.
There are minor changes to ON Semiconductor case outline 221A-09, including F dimension
(Hole diameter) change from 3.73mm max to 4.09mm max (in accordance with JEDEC max).
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly and Test Site |
| |
| Key Milestones |
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| Effective Date: |
|
2007-11-22 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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