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Уведомление об обновлениях схем

Change Notification #   16041
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   DPAK Package Mold Compound Change
Issue Date   2007-08-30
Affected Product Family  
Description   As a part of ON Semiconductors continuous improvement programs, the mold compound for the Dpak package assembled at the ON Semiconductor factory located at Seremban, Malaysia, will be changing. The same supplier of the existing compound will be used but the formulation will be modified for improved reliability in terms of moisture testing and delamination (SAT) performance.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2007-12-30
Sample Info:   Contact your local ON Semiconductor sales office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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