Уведомление об обновлениях схем
| Change Notification # |
|
16080 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN SOIC WB EXPANSION FOR OSPI |
| Issue Date |
|
2007-12-18 |
| Affected Product Family |
|
|
| Description |
|
This is one of multiple Final Process Change Notices to IPCN 15621 available at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/24/28 lead Wide body SOIC packages. The devices listed on this FPCN have historically been assembled/tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Final PCN, these devices may be processed at either location. This is not a transfer but a capacity expansion. Devices will be qualified in phases with only those devices listed below affected by
this FPCN.
|
| Key Items Affected by Change |
|
On Semi Assembly and Test |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-03-18 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|