Уведомление об обновлениях схем
| Change Notification # |
|
16090 |
| Revision |
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|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN for Qualification of UDFN/UQFN 0.5mm Package Thickness (1.0x1.2mm to 3.0x3.0mm) at ON Semiconductor SBN and at UTAC (Bangkok, Thailand) |
| Issue Date |
|
2008-01-14 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Product Change Notice (FPCN) notifying customers that the changes described in PCN 15676 (which can be found at www.onsemi.com), have been completed for the listed devices.
There will be no changes in device functionality, case outline, or footprint. Reliability will continue to meet or exceed ON Semiconductor’s highest standards. Upon expiration of this FPCN, all UDFN/UQFN (1.0x1.2mm to 3.0x3.0mm) 0.55mm max thickness devices will be sourced from both the ON Semiconductor Seremban (Malaysia) facility and the UTAC facility located in Bangkok, Thailand. Any new devices/derivatives packaged on the same platforms released after publication of this inclusive FPCN will be qualified for assembly in both locations.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly & Test |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-04-14 |
| Sample Info: |
|
ON Semiconductor Assembly & Test |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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