Уведомление об обновлениях схем
| Change Notification # |
|
16100 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Dpak Package Mold Compound Change – Discrete Products |
| Issue Date |
|
2008-02-26 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Product Change Notice for a Mold Compound change previously announced in IPCN # 16041 issued on 30 August 2007. This FPCN is being issued only for Discrete (IGBTs, MOSFETs, Bipolar Transistors, Rectifier Diodes) products in the Dpak style package. All Qualification and Reliability testing has been completed and has passed all established criteria.
As part of ON Semiconductor’s continuous improvement programs, the mold compound for the Dpak package assembled at the ON Semiconductor factory located at Seremban, Malaysia, will be changing. The same supplier of the existing compound will be used but the formulation will be modified for improved reliability in terms of moisture testing and delamination(SAT)performance.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-05-26 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|