Уведомление об обновлениях схем
| Change Notification # |
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16116 |
| Revision |
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| Type of Notification |
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INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
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Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for Devices Currently Fabricated at XFAB Wafer Foundries |
| Issue Date |
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2008-05-13 |
| Affected Product Family |
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| Description |
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ON Semiconductor is pleased to announce a capacity expansion qualification for devices currently fabricated at the XFAB wafer foundries.
Products currently qualified at the XFAB wafer foundry facilities (located in Erfurt, Germany and Lubbock, Texas) will now also be qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration of the associated Final PCN(s), devices may be supplied from either the XFAB foundries or the Gresham fab.
The Gresham wafer fab is ISO9001:2000 compliant. The products currently run on XFAB’s 0.6um BiCMOS process. Devices will be qualified to run at Gresham on the 0.25um “ONC25” process. Device performance will be the same among the qualified facilities for each device family. All devices will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this foundry expansion qualification.
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| Key Items Affected by Change |
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ON Semi Fab Site / Subcontractor Fab Site |
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| Key Milestones |
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| Effective Date: |
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2008-09-13 |
| Sample Info: |
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Contact your local ON semiconductor Sales Office |
| Possible Replacements |
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N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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