Уведомление об обновлениях схем
| Change Notification # |
|
16227 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper Wire in SOIC and TSSOP packaged Products |
| Issue Date |
|
2009-05-03 |
| Affected Product Family |
|
|
| Description |
|
A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wirebond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippine assembly location. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-06-03 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|