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Уведомление об обновлениях схем

Change Notification #   16235
Revision  
Type of Notification   UPDATE NOTIFICATION
Change Title   Wafer Fab Transfer for Devices Currently Qualified at ON Semiconductor Piestany, Slovakia Wafer Fab
Issue Date   2009-03-19
Affected Product Family  
Description   This is an Update Notification to Initial PCN # 16223, which announced the qualification of TSMC and Gresham wafer fabs as manufacturing sites for devices currently fabricated at the ON Semiconductor Piestany, Slovakia wafer fab. This Update Notification adds 3 part numbers to the list of affected devices (see affected device list at the end of this notification). ON Semiconductor is pleased to announce that as a result of the previously announced plans to close the Piestany, Slovakia wafer fabrication facility, devices currently qualified for production at that fab are now being qualified for production at ON Semiconductor’s Gresham wafer fab (located in Gresham, Oregon) and/or at TSMC wafer fab in Taiwan. Upon expiration of the associated Final PCN(s), devices may be supplied from any of the qualified fabrication facilities, including the Piestany fab.
Key Items Affected by Change   ON Semi Fab Site / Subcontractor Fab Site
 
Key Milestones  
Effective Date:   2009-06-20
Sample Info:   Contact your local ON Semiconductor Sales Office or Todd Manes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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