Уведомление об обновлениях схем
| Change Notification # |
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16235 |
| Revision |
|
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| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Wafer Fab Transfer for Devices Currently Qualified at ON Semiconductor Piestany, Slovakia Wafer Fab |
| Issue Date |
|
2009-03-19 |
| Affected Product Family |
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| Description |
|
This is an Update Notification to Initial PCN # 16223, which announced the qualification of TSMC and Gresham wafer fabs as manufacturing sites for devices currently fabricated at the ON Semiconductor Piestany, Slovakia wafer fab. This Update Notification adds 3 part numbers to the list of affected devices (see affected device list at the end of this notification).
ON Semiconductor is pleased to announce that as a result of the previously announced plans to close the Piestany, Slovakia wafer fabrication facility, devices currently qualified for production at that fab are now being qualified for production at ON Semiconductor’s Gresham wafer fab (located in Gresham, Oregon) and/or at TSMC wafer fab in Taiwan.
Upon expiration of the associated Final PCN(s), devices may be supplied from any of the qualified fabrication facilities, including the Piestany fab.
|
| Key Items Affected by Change |
|
ON Semi Fab Site / Subcontractor Fab Site |
| |
| Key Milestones |
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| Effective Date: |
|
2009-06-20 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Todd Manes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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