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Уведомление об обновлениях схем

Change Notification #   16248
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of OSPI for Assembly and Final Test for SO8 Packages
Issue Date   2009-04-15
Affected Product Family  
Description   This is the Final PCN to Initial PCN 16173 located at www.onsemi.com announcing the successful completion of the qualification for the ON Semiconductor internal manufacturing site in Carmona, Philippines (OSPI) as an additional manufacturing site for SO-8 package assembly and final test. There will be no changes in the wafer/die source. Device functionality will be unchanged. Device parameters will continue to meet all Data Book specifications and reliability will continue to meet or exceed ON Semiconductor standards. This change is classified as capacity expansion. The products listed below can be manufactured at either OSPI or the existing facility, Unisem in Indonesia, once the final PCN expires.
Key Items Affected by Change   ON Semiconductor Assembly Site
 
Key Milestones  
Effective Date:   2009-07-14
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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